Potato Wafer Machine

The Potato Wafer Machine is designed for efficiently slicing and processing potatoes into thin, crisp wafers. This machine is ideal for commercial production of potato wafers, making it perfect for snack manufacturers, food processing units, and restaurants. It ensures consistent slicing, producing uniform wafers that fry to perfection, delivering high-quality results with every batch.

Made with high-quality stainless steel, the Potato Wafer Machine is durable, easy to clean, and hygienic. The machine’s slicing mechanism can handle high volumes, allowing for a smooth and continuous production process. Whether for small businesses or large-scale operations, this machine offers reliability and efficiency for producing delicious potato wafers.

General Specifications – Potato Wafer Machine

• Body Material: Stainless Steel (S.S.)

• Motor Power: 1 HP to 5 HP (depending on model)

• Slicing Capacity: 50 Kg/hr to 300 Kg/hr (depending on model)

• Power Supply: 220V (Single Phase) / 440V (Three Phase)

• Blade Type: Stainless steel slicing blade for uniform wafer thickness

• Slicing Thickness: Adjustable for different wafer textures

• Operation Type: Semi-Automatic or Automatic

• Cleaning: Easy-to-remove parts for cleaning and maintenance

• Dimensions: Customized based on the model and capacity

• Weight: 50 Kg to 150 Kg (depending on model and capacity)